SK hynix introduces 238-layer 3D-nand for quicker, cheaper SSDs

Reminiscence producer SK hynix has developed 3D Nand reminiscence with 238 layers, the very best variety of layers within the trade. These chips would be the first for use in desktop SSDs. Mass manufacturing will start within the first half of subsequent 12 months.

238 layer nand reminiscence is tlc nand and must be present technology nand with 176 layers observe up, writes SK hynix. The South Korean producer is introducing a brand new kind of reminiscence within the type of 512 Gigabit chips, every with a capability of 64 GB. Over time, this density must be doubled to 1 Tbps, or 128 GB per chip.

In keeping with the producer, the velocity is 50% quicker than the earlier technology nandflash, with a switch charge of two.4Gbps per chip. Learn energy consumption was additionally decreased by 21 p.c. Furthermore, with a step of 238 layers, the die dimension for tlc nand chips is decreased, which implies that SK hynix can extract extra reminiscence from the wafer. This could guarantee, amongst different issues, decrease manufacturing prices.

The producer calls this reminiscence “4d-nand,” a advertising identify the corporate has been utilizing since 2018 to seek advice from reminiscence with a flash-trapflash or ctf design and under-cell structure. in ctf these prices are saved in an insulator. Historically, nand chips are made with floating gate designs, wherein electrical prices are saved in a conductor. The ctf method is to keep away from inter-memory interference to enhance efficiency. bee periphery below the cell develop into peripheral circuits positioned immediately under the reminiscence cell. Normally these circuits are positioned close to the reminiscence cell. In keeping with SK hynix, this improves manufacturing effectivity and density.

SK hynix will start mass manufacturing of its 238-layer NAND reminiscence within the first half of 2023. The chips are primarily utilized in consumer SSDs for PCs and laptops. Server SSDs and storage chips for smartphones will come later. 1Tbit chips with 238 layers may even observe in 2023, however no extra particular launch date has been given.

Bron: SC Hynix

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